Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6402217
Kind Code:
B2
Inventors:
Shinji Wakisaka
Application Number:
JP2017049758A
Publication Date:
October 10, 2018
Filing Date:
March 15, 2017
Export Citation:
Assignee:
Aoi Electronics Co., Ltd.
International Classes:
H01L23/12; H05K3/00; H05K3/28
Domestic Patent References:
| JP2010245565A | ||||
| JP2006229111A | ||||
| JP2014216645A | ||||
| JP2007149977A | ||||
| JP2012064981A | ||||
| JP2011146687A | ||||
| JP2011171567A | ||||
| JP20037922A |
Attorney, Agent or Firm:
Fuyuki Nagai
Keiichi Ikeda
Keiichi Ikeda