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Title:
半導体装置および半導体装置の設計方法
Document Type and Number:
Japanese Patent JP6994186
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving the measurement sensitivity while preventing damages on the semiconductor base plate, a laminated body on the semiconductor base plate or peeling from a housing when disposed on a measuring object, and a design method of semiconductor device.SOLUTION: The semiconductor device includes: a semiconductor base plate 12; a first electrode 20-1 formed on the semiconductor base plate 12, which outputs input measuring signal as an input signal; and a second electrode 20-2 formed on the semiconductor base plate 12, to which an input signal output from the first electrode 20-1 is input and which outputs the input signal as an output signal. Each of the first electrode 20-1 and the second electrode 20-2 has a second side which faces a first side and forms an acute angle between the first side and the second side.SELECTED DRAWING: Figure 1

Inventors:
Kenichiro Kusano
Masato Futagawa
Application Number:
JP2017023082A
Publication Date:
January 14, 2022
Filing Date:
February 10, 2017
Export Citation:
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Assignee:
LAPIS Semiconductor Co., Ltd.
National University Corporation Shizuoka University
International Classes:
G01N27/04; G01N33/24; H01L21/82; H01L21/822; H01L27/04
Domestic Patent References:
JP4030533Y2
JP2008039523A
JP5098484A
JP2013090576A
Foreign References:
WO2011040244A1
US20150338363
Other References:
小笠原慎,低水分土壌計測を可能とするシールド電極型土壌インピーダンスセンサの開発,第33回「センサ・マイクロマシンと応用システム」シンポジウム論文集,2016年10月17日,24pm3-B-6,pp.1-5
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazuho
Hiroshi Fukuda