Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021197490
Kind Code:
A
Abstract:
To provide a semiconductor device in which bonding force between an insulated circuit board, a semiconductor chip, or the like and a printed circuit board is enhanced, and the bonding property is excellent.SOLUTION: A semiconductor device includes an insulation circuit board 1, semiconductor chips 3a and 3b mounted on the insulation circuit board 1, and a printed circuit board 6 placed above the semiconductor chips 3a and 3b, pin terminals 5a to 5f that are inserted into the printed circuit board 6 and joined to the semiconductor chips 3a and 3b via joining materials 4a to 4f, support portions 71a and 72a arranged on the insulation circuit board 1, and a sealing member 8 that seals the semiconductor chips 3a and 3b, the support portions 71a and 72a, and the printed circuit board 6, and the height from the upper surface of the insulation circuit board 1 to the upper surfaces of the support portions 71a and 72a is higher than the height from the upper surface of the insulation circuit board 1 to the upper surfaces of the semiconductor chips 3a and 3b.SELECTED DRAWING: Figure 1
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Inventors:
HAYAKAWA TSUTOMU
Application Number:
JP2020104226A
Publication Date:
December 27, 2021
Filing Date:
June 17, 2020
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L21/60; H01L25/04; H01L25/18
Attorney, Agent or Firm:
Ichi Hirose
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