Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP4878518
Kind Code:
B2
Inventors:
Naokawa Kawahara
Kazuyoshi Ueno
Kazuyoshi Ueno
Application Number:
JP2006206435A
Publication Date:
February 15, 2012
Filing Date:
July 28, 2006
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L23/52; H01L21/3205
Domestic Patent References:
| JP2004533123A | ||||
| JP2005129808A | ||||
| JP10261715A | ||||
| JP11087509A | ||||
| JP2005536628A | ||||
| JP11307476A |
Foreign References:
| WO2005109490A1 | ||||
| WO2007040860A1 |
Attorney, Agent or Firm:
Shinji Hayami