Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5171877
Kind Code:
B2
Inventors:
Aki Shiraishi
Application Number:
JP2010100866A
Publication Date:
March 27, 2013
Filing Date:
April 26, 2010
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L23/12; H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
| JP2000195861A | ||||
| JP2003273106A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Takashi Okamura
Horimai Kazuharu
Takashi Okamura