Title:
半導体素子及びその製造方法
Document Type and Number:
Japanese Patent JP5181462
Kind Code:
B2
Inventors:
Takashi Kinoshita
Application Number:
JP2006296272A
Publication Date:
April 10, 2013
Filing Date:
October 31, 2006
Export Citation:
Assignee:
Fuji Xerox Co., Ltd
International Classes:
H01L21/28; B41J2/44; B41J2/45; B41J2/455; C23C8/10; C23C28/00; H01L31/12; H01L33/08; H01L33/22; H01L33/40; H01L33/44; H01L33/58
Domestic Patent References:
| JP61267348A | ||||
| JP64013740A | ||||
| JP2000100815A | ||||
| JP4363024A | ||||
| JP3159243A | ||||
| JP2005340767A | ||||
| JP2004158767A |
Attorney, Agent or Firm:
Jiro Kobe
Takeshi Senda
Takeshi Senda