Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP5218497
Kind Code:
B2
Abstract:
A region divided substrate includes a substrate, a plurality of trenches, a conductive layer, and an insulating member. The substrate has a first surface and a second surface opposed to each other. The trenches penetrate the substrate from the first surface to the second surface and divide the substrate into a plurality of partial regions. The conductive layer is disposed on a sidewall of each of the trenches from a portion adjacent to the first surface to a portion adjacent to the second surface. The conductive layer has an electric conductivity higher than an electric conductivity of the substrate. The insulating member fills each of the trenches through the conductive layer.
Inventors:
Tetsuo Fujii
Masaya Tanaka
Keisuke Goto
Masaya Tanaka
Keisuke Goto
Application Number:
JP2010176742A
Publication Date:
June 26, 2013
Filing Date:
August 05, 2010
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L29/84; B81B3/00; B81C1/00; G01C19/56; G01C19/5769; G01P15/08; G01P15/125; H01L21/3205; H01L21/76; H01L21/768; H01L23/02; H01L23/522; H01L27/00
Domestic Patent References:
| JP2008229833A | ||||
| JP2003289073A | ||||
| JP2007520051A | ||||
| JP2006270098A | ||||
| JP2006275660A | ||||
| JP2007524995A |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo