Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP5674121
Kind Code:
B2
Inventors:
神谷 宅美
Application Number:
JP2010278034A
Publication Date:
February 25, 2015
Filing Date:
December 14, 2010
Export Citation:
Assignee:
トヨタ自動車株式会社
International Classes:
H01L21/331; H01L21/76; H01L21/762; H01L27/12; H01L29/73; H01L29/732
Attorney, Agent or Firm:
Patent business corporation Ogasawara patent firm