Title:
半導体素子及びその製造方法
Document Type and Number:
Japanese Patent JP5763154
Kind Code:
B2
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Inventors:
Tatsuo Shimizu
Takashi Shito
Takashi Shito
Application Number:
JP2013240158A
Publication Date:
August 12, 2015
Filing Date:
November 20, 2013
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/336; H01L21/316; H01L29/12; H01L29/739; H01L29/78
Domestic Patent References:
| JP2012074513A | ||||
| JP2008182070A | ||||
| JP2008117878A | ||||
| JP2009158933A | ||||
| JP9318245A |
Foreign References:
| US20080191217 |
Attorney, Agent or Firm:
Tetsuma Ikegami
Akira Sudo
Mitsuyuki Matsuyama
Akira Sudo
Mitsuyuki Matsuyama