Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
Semiconductor devices and their manufacturing methods
Document Type and Number:
Japanese Patent JP6327139
Kind Code:
B2
More Like This:
WO/2014/192444SEMICONDUCTOR DEVICE
JP2023136028SEMICONDUCTOR DEVICE
WO/2018/096684SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Inventors:
Toru Oka
Kazuya Hasegawa
Shigeaki Tanaka
Murakami Rinsho
Ueno Yukihisa
Application Number:
JP2014248848A
Publication Date:
May 23, 2018
Filing Date:
December 09, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toyoda Gosei Co., Ltd.
International Classes:
H01L29/872; H01L21/316; H01L21/329; H01L21/336; H01L21/338; H01L29/06; H01L29/12; H01L29/41; H01L29/417; H01L29/47; H01L29/778; H01L29/78; H01L29/786; H01L29/812; H01L29/861; H01L29/868
Domestic Patent References:
JP2009111204A
JP2014229879A
JP2012038906A
JP2011071247A
Foreign References:
WO2013080769A1
Attorney, Agent or Firm:
Meisei International Patent Office



 
Previous Patent: Receiver

Next Patent: CHECKING DEVICE FOR EQUIPMENT MOUNTED WITH MICROCOMPUTER