Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP7045912
Kind Code:
B2
Abstract:
To provide a semiconductor device capable of cooling a power module efficiently while improving productivity.SOLUTION: A semiconductor device comprises power modules 2, and a U-shaped cooler 3 for cooling the power modules 2 from above and below. The cooler 3 includes an upper cooling part 4 where the lower wall 6 is in contact with the upper surface of the power modules 2, a lower cooling part 10 where the upper wall 11 is in contact with the lower surface of the power modules 2, and a coupling part 15 for coupling the upper and lower cooling parts 4, 10. Cooling liquid passages 8, 14 of the upper and lower cooling parts 4, 10 are interconnected by a cooling liquid passage 19 of the coupling part 15, the lower wall 6 of the upper cooling part 4, the upper wall 11 of the lower cooling part 10 and the inner wall 16 of the coupling part 15 are formed integrally of one metal plate, and the upper wall 5 of the upper cooling part 4, the lower wall 12 of the lower cooling part 10 and the outer wall 17 of the coupling part 15 are formed integrally of one metal plate.SELECTED DRAWING: Figure 4
Inventors:
Shinobu Tamura
Application Number:
JP2018075835A
Publication Date:
April 01, 2022
Filing Date:
April 11, 2018
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| JP2003021445A | ||||
| JP2016074015A |
Foreign References:
| US20170365890 | ||||
| US20070097627 | ||||
| US20170336152 |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Ken Takada
Kenfumi Sugiura
Hisayoshi Shimizu
Ken Takada
Kenfumi Sugiura