Title:
SEMICONDUCTOR DIFFERENTIAL PRESSURE MEASURING DEVICE
Document Type and Number:
Japanese Patent JP2005043198
Kind Code:
A
Abstract:
To provide a semiconductor differential pressure measuring device having an excessive pressure protection means and a damping means in a sensor chip.
The semiconductor differential pressure measuring device is equipped with a recession which is provided in a semiconductor chip, constitutes a diaphragm of a strain producing section in this semiconductor chip, is equipped with a damping means which has a supporting stand arranged in the recession being opposed to the diaphragm keeping a clearance, and a sealed liquid put in the clearance.
Inventors:
ARAI YUJI
NISHIKAWA SUNAO
NISHIKAWA SUNAO
Application Number:
JP2003277215A
Publication Date:
February 17, 2005
Filing Date:
July 22, 2003
Export Citation:
Assignee:
YOKOGAWA ELECTRIC CORP
International Classes:
G01L13/06; G01L9/00; H01L29/84; (IPC1-7): G01L13/06; H01L29/84