Title:
SEMICONDUCTOR DYNAMIC SENSOR DEVICE
Document Type and Number:
Japanese Patent JPH08110351
Kind Code:
A
Abstract:
PURPOSE: To miniaturize a device by eliminating a glass stage between an IC for control and an acceleration sensor.
CONSTITUTION: An IC 2 for control and an IC for drive 3 are die-mounted on a ceramic substrate 1 with an adhesive 5a and an acceleration sensor 4 is die-mounted to a center region on the IC 2 for control with an adhesive 5b. Then, the acceleration sensor 4 and the IC 2 for control are electrically connected with a wire 6.
Inventors:
HIROSE SHINICHI
MIZUNO NAOHITO
MIZUNO NAOHITO
Application Number:
JP24635794A
Publication Date:
April 30, 1996
Filing Date:
October 12, 1994
Export Citation:
Assignee:
NIPPON DENSO CO
International Classes:
G01L1/22; G01P15/08; (IPC1-7): G01P15/08; G01L1/22
Attorney, Agent or Firm:
Yoji Ito
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