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Patent Searching and Data


Title:
SEMICONDUCTOR ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JPS6477199
Kind Code:
A
Abstract:

PURPOSE: To provide a semiconductor electronic device which has high cooling efficiency by interposing the edge of a substrate in the tapered section of a cold plate to fasten and fix a cam to the cold plate with a bolt or a nut.

CONSTITUTION: A cold plate 5 provided over a controlling LSI 2 has a refrigerant flow path 8 which has a water supply port 6 and an exhaust port 7 at the both ends. The below surface of the edge adjoining a substrate 4 of a cold plate 5 is shaped in sawtooth. A cam 11 provided with a tilted surface corresponding to each tapered section 13 also has a through-hole 15 passing through up and down. A heat connector is formed by attaching the cam 11 to the cold plate 5 by passing a bolt 12 provided with a screw 12a at the edge through the through-hole 15 of the cam 11 and a through-hole 14 of the tapered section 13 and fixing it with a nut 10.


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Inventors:
TAKAMOTO MITSUO
Application Number:
JP23381787A
Publication Date:
March 23, 1989
Filing Date:
September 18, 1987
Export Citation:
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Assignee:
NEC CORP
International Classes:
H01L23/473; H01L23/46; H05K7/20; (IPC1-7): H01L23/46; H05K7/20
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)