PURPOSE: To simplify the formation of a semiconductor element assembling structure and to improve the workability thereof by stamping a lead frame of special shape from one uniformly thick metallic thin plate and assembling it with a heat dissipating block unit.
CONSTITUTION: One uniformly thick metallic thin plate is stamped in a body having a plurality of, such as three, lead wires 11W13, one of which as designated by 12 has a wide portion 14. The wide portion 14 is placed with a solder plate thereon, is bonded with a heat dissipating block unit 20 having a semiconductor element substrate placing portion at predetermined position by controlling the position by the folded portion, and a semiconductor substrate 19 is then placed on the block unit 20. The block unit 20 and the lead wires are made of copper. In this manner, the copper plate of the body is wound in rolled state for an easy machining to simplify the formation of the assembling, regulating procedure for positioning and to improve the production workability.
| JP6672497 | Semiconductor device |
| JP6084567 | The seal adhesive constituent for electronic devices |
TATENO KENICHI
NISHIKAWA MIKIO
