Title:
SEMICONDUCTOR ELEMENT CARRIER
Document Type and Number:
Japanese Patent JPS60759
Kind Code:
A
Abstract:
PURPOSE: To facilitate the inspection of connection parts at the step of connection between external connection members and the titled carrier by leading a bonding pattern out of the cap.
CONSTITUTION: Said carrier 7 has the bonding pattern 3 led out of the cap 2', and the extension of the pattern 3 being made as an inspection pattern 11. Therefore, the contact of a contactor for conducting inspection with this pattern 11 becomes facilitated. Since the connection parts 8 are connected to an external pattern 10 via internal wiring in a wiring substrate 4, the conducting inspection by the contact of the contactor with the pattern 11 and the pattern 10 of the substrate 4 enables to easily judge the conditions of the solder connection parts.
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Inventors:
TOKUNAGA YUTAKA
Application Number:
JP10768483A
Publication Date:
January 05, 1985
Filing Date:
June 17, 1983
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/12; H01L21/60; H01L21/66; H01L23/498; H01L23/50; H05K1/02; H05K3/34; (IPC1-7): H01L23/12; H01L23/48; H05K1/18
Attorney, Agent or Firm:
Katsuo Ogawa
Next Patent: RESIN-MOLDED TYPE SEMICONDUCTOR DEVICE