Title:
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MOUNTING STRUCTURE
Document Type and Number:
Japanese Patent JP3922618
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor element using a thermosetting resin material, which has favorable heat resistance and little change in the elastic modulus at high temperature and hardly has cracks or peeling, and to provide its semiconductor device and semiconductor mounting structure.
SOLUTION: In this semiconductor element, at least part of a semiconductor chip is coated and/or sealed with a thermosetting resin material. The thermosetting resin material is composed of a thermosetting resin material containing a polyadditional thermosetting resin, a specific organic silicon compound and a setting agent of the polyadditional thermosetting resin. The maximum temperature of an interface of the thermosetting resin material during an operation of the semiconductor chip exceeds 150°C. This semiconductor element and a semiconductor device using the same and a mounting structure are provided.
Inventors:
Nobuyasu Kanagawa
Yuichi Satsu
Akio Takahashi
Kohei Sakurai
Toshio Hayashibara
Mitsuru Watanabe
Yuichi Satsu
Akio Takahashi
Kohei Sakurai
Toshio Hayashibara
Mitsuru Watanabe
Application Number:
JP2000104035A
Publication Date:
May 30, 2007
Filing Date:
April 05, 2000
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
C08L83/04; H01L23/29; C08G59/32; C08G77/04; C08L101/00; H01L23/31; (IPC1-7): H01L23/29; H01L23/31; C08G59/32; C08G77/04; C08L83/04; C08L101/00
Domestic Patent References:
| JP6279586A | ||||
| JP10275810A | ||||
| JP883880A |
Attorney, Agent or Firm:
Yukihiko Takada
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