SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

Title:

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP3874709

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces the space utilized, when mounting a semiconductor element without causing deterioration of element characteristics.
SOLUTION: The semiconductor element comprises an air bridge formed so as to coat an element, such as FBAR or the like formed on a surface of a semiconductor substrate via an air gap. The semiconductor device is sealed with a resin, having the air gap for forming the air bridge.

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Inventors:

Yuji Iseki
Hiroyuki Kayano
Yuta Araki
Yasuaki Yasumoto
Kazuhide Abe
Kenya Sano
Ryoichi Ohara
Kazuhiko Itaya
Takashi Kawakubo

Application Number:

JP2002274367A

Publication Date:

January 31, 2007

Filing Date:

September 20, 2002

Export Citation:

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Assignee:

Toshiba Corporation

International Classes:

H01L23/08; H01L23/12; H01L23/02; (IPC1-7): H01L23/08; H01L23/02; H01L23/12

Domestic Patent References:

JP5090872A
JP8316778A

Attorney, Agent or Firm:

Hiroshi Horiguchi

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