Title:
半導体素子駆動回路
Document Type and Number:
Japanese Patent JP4957916
Kind Code:
B2
Inventors:
Hiroyuki Okabe
Application Number:
JP2008164857A
Publication Date:
June 20, 2012
Filing Date:
June 24, 2008
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H03K17/08; H02M1/00; H02M1/08; H03K17/687
Domestic Patent References:
| JP11195971A | ||||
| JP2001345688A | ||||
| JP3040517A | ||||
| JP2007028711A | ||||
| JP2000323974A | ||||
| JP8321756A |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa