Title:
半導体素子製造装置
Document Type and Number:
Japanese Patent JP5429921
Kind Code:
B2
Inventors:
Takeshi Hase
Application Number:
JP2008134782A
Publication Date:
February 26, 2014
Filing Date:
May 22, 2008
Export Citation:
Assignee:
Ueno Seiki Co., Ltd.
International Classes:
H01L23/00; B23K26/00; B23K26/142; B23K26/16
Domestic Patent References:
| JP9248692A | ||||
| JP2007021574A | ||||
| JP2005188416A | ||||
| JP2006306617A |
Attorney, Agent or Firm:
Kiuchi Mitsuharu