To provide a semiconductor element and a manufacturing method of the same which inhibit defects such as burr occurring when a chip is cut out of a support substrate on which an element region is formed via a junction metal film.
The semiconductor element comprises a support substrate and a laminated body bonded on the support substrate via a junction metal layer. The semiconductor element comprises an element part having layers from a bottom layer to a top layer included in the laminated body and a peripheral part provided around the element part in such a manner as to surround the element part. The peripheral part is a part of the layers from the bottom layer to the top layer included in the laminated body and includes at least a part of a semiconductor layer contacting the junction metal layer.
TOMARIHO TAKASHI
MATSUNAGA NORIHIKO
YOSHIMURA KIMITAKA
KONDO KATSUAKI
| JP2009123754A | 2009-06-04 |