To provide a semiconductor element with bump in which good connection reliability is achieved between the semiconductor element with bump and a circuit board.
The semiconductor element with bumps comprises a substrate 3, a semiconductor circuit provided on the substrate 3, an insulating film formed on the semiconductor circuit, a portion on the insulating film where the insulating film is not formed, and a conductor pad 6a formed in the portion where the insulating film is not formed and connected with the semiconductor circuit wherein the conductor pad 6a is connected with a transfer bump 8 formed by intaglio transcription. Since the clearance 25 can be enlarged between a circuit board 7 and a semiconductor element, thermal stress generated due to difference of linear expansion coefficient can be relaxed between the semiconductor element 1 with bump and the circuit board 7.
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HARADA SHINJI
UENISHI KENJI
Hiroki Naito
Daisuke Nagano