Title:
半導体素子および半導体装置
Document Type and Number:
Japanese Patent JP7157630
Kind Code:
B2
Abstract:
A semiconductor element includes an element body, a surface protective film and an electrode. The element body has a front surface and a side surface connected to the front surface. The surface protective film is supported on the front surface of the element body. The surface protective film has a cutout portion recessed inward from an outer edge of the surface protective film as viewed in a thickness direction of the element body. The electrode is disposed in the cutout portion and electrically connected to the element body. The element body has a ledge protruding with respect to the side surface in a direction perpendicular to the thickness direction. The ledge is adjacent to an opening of the cutout portion as viewed in the thickness direction.
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Inventors:
Motoharu Haga
Application Number:
JP2018208123A
Publication Date:
October 20, 2022
Filing Date:
November 05, 2018
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/52; H01L21/3205; H01L21/60; H01L21/768; H01L23/522; H01L23/532
Domestic Patent References:
| JP201819006A | ||||
| JP2001274129A | ||||
| JP200976950A | ||||
| JP2009135348A |
Attorney, Agent or Firm:
Minoru Yoshida
Usui Nao
Usui Nao
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