Title:
Semiconductor emission device
Document Type and Number:
Japanese Patent JP6062431
Kind Code:
B2
Abstract:
A semiconductor light emitting device includes: a semiconductor light emitting element including a transparent substrate; a reflective substrate on which the semiconductor light emitting element is mounted; an adhesive layer containing a fluorescent substance, for fixing the semiconductor light emitting element on the reflective substrate; and a sealing member containing a fluorescent substance, for sealing the semiconductor light emitting element. In the semiconductor light emitting device, the adhesive layer has a thickness equal to or smaller than average particle size of the fluorescent substance contained in the sealing member.
Inventors:
Tsuyoshi Kamikawa
Application Number:
JP2014521254A
Publication Date:
January 18, 2017
Filing Date:
May 29, 2013
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L33/50; H01L33/32
Domestic Patent References:
| JP2009267289A | ||||
| JP2001036150A | ||||
| JP2004071710A | ||||
| JP2011134761A | ||||
| JP2012087162A | ||||
| JP2011129661A |
Attorney, Agent or Firm:
Satoshi Shimizu