Title:
半導体装置及びその製造方法、ドライエッチング方法、配線材料の作製方法、並びにエッチング装置
Document Type and Number:
Japanese Patent JPWO2007116515
Kind Code:
A
Inventors:
Yuji Furumura
Village Naomi
Wood Toshio
Yasuhiro Morikawa
Michio Ishikawa
Village Naomi
Wood Toshio
Yasuhiro Morikawa
Michio Ishikawa
Application Number:
JP2006307499W
Publication Date:
October 18, 2007
Filing Date:
April 07, 2006
Export Citation:
Assignee:
Filtec, Inc.
International Classes:
H01L29/788; H01L21/3213; H01L29/78; H01L21/8247; H01L27/10; H01L21/3065; H01L29/49; H01L27/108; H01L21/28; H01L21/768; H01L27/115; H01L29/792; H01L21/8242; H01L29/423; H01L21/336
Attorney, Agent or Firm:
Katsutoshi Muranaka
Hiroyuki Kurihara
SEIGA Patent and Trademark Corporation
Hiroyuki Kurihara
SEIGA Patent and Trademark Corporation