Title:
半導体評価回路及び半導体評価方法
Document Type and Number:
Japanese Patent JP5292906
Kind Code:
B2
Inventors:
Hiroshi Takashima
Masamichi Asano
Masamichi Asano
Application Number:
JP2008111233A
Publication Date:
September 18, 2013
Filing Date:
April 22, 2008
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H01L21/66; H01L21/822; H01L27/04
Domestic Patent References:
| JP2009224553A | ||||
| JP2007243160A | ||||
| JP2000149594A | ||||
| JP10242397A | ||||
| JP2002288997A | ||||
| JP2002222922A | ||||
| JP1183148A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Yasuhiko Murayama