Title:
SEMICONDUCTOR FACTORY
Document Type and Number:
Japanese Patent JP3884190
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To rationally (in a short period at a low cost) constitute the floor structure of the manufacturing floor of a factory for a semiconductor, a liquid crystal or the like.
SOLUTION: The semiconductor factory 1 has a floor partitioning a manufacturing floor, on which a principal manufacturing equipment 13 is installed, and a utility floor 12 on which pipings, electric cables and ducts supplying the principal manufacturing equipment 13 with utilities (electricity, cooling water, a gas and others) are mounted in the lower section of the manufacturing floor, the principal section is manufactured of reinforcements or steel frames or reinforced or steel-framed concrete (RC or SRC) in the floor, a load supporting leg section 31 with a leveling mechanism 31a is set up in the principal manufacturing equipment 13 or the equipment 13 is placed on a base with the leveling mechanism 31a and fitted on the floor face, and a floor for the walking of a person and for the traveling of a device 32 for transporting products and materials or a manufacturing equipment floor on which a rail is mounted are disposed on the floor face.
More Like This:
Inventors:
Jiro Kakizaki
Application Number:
JP22510899A
Publication Date:
February 21, 2007
Filing Date:
August 09, 1999
Export Citation:
Assignee:
TAKENAKA CORPORATION
International Classes:
E04H5/02; (IPC1-7): E04H5/02
Domestic Patent References:
| JP10160220A | ||||
| JP9222248A | ||||
| JP62202948A |
Attorney, Agent or Firm:
Furuya Fumio
Eisuke Suzuki
Eisuke Suzuki
Previous Patent: ADVANCED LASER DIODE AND SUBSTRATE
Next Patent: OPTICAL FIBER WELDING AND CONNECTING DEVICE
Next Patent: OPTICAL FIBER WELDING AND CONNECTING DEVICE