To provide a film for a semiconductor which does not require a flux cleansing process, offers superior productivity, and improves workability in processing a semiconductor wafer.

The film for the semiconductor is the laminated film consisting of a back grind tape and an adhesive layer. The adhesive layer is made of a resin composition containing a resin capable of bridging and a compound having flux activity. A method for manufacturing a semiconductor device includes: a step for bonding the adhesive layer of the film for the semiconductor to a functional surface of a semiconductor wafer having preformed solder bumps; a step for grinding the surface opposite to the functional surface; a step for dividing the semiconductor wafer into individual pieces to obtain a semiconductor element; and a step for peeling the semiconductor element between the back grind tape and the adhesive layer of the film for the semiconductor and picking the semiconductor element to mount it on a substrate.

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