Title:
SEMICONDUCTOR HEAT-GENERATING DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH0989617
Kind Code:
A
Abstract:
To provide a semiconductor heal-generating device by reducing heat which escapes an electrical heating element to a silicon substrate.
An electrical heating element 14 is provided only on a supporting film 13 for connecting silicon oxide heat-insulating layers 12 formed on a silicon substrate 11, the edge part of the electrical heating element 14 and an area on the silicon oxide heat-insulating layers 12 are connected by a metal leading wire 15, and at the same time a heat-insulating space 18 is provided on the reverse side of the supporting film 13.
Inventors:
KONDA NORIHIRO
Application Number:
JP23993095A
Publication Date:
April 04, 1997
Filing Date:
September 19, 1995
Export Citation:
Assignee:
TOKYO GAS CO LTD
International Classes:
G01F1/68; G01F1/688; G01F1/692; (IPC1-7): G01F1/68
Attorney, Agent or Firm:
Yoshiaki Numagata (2 outside)
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