Title:
半導体熱処理装置
Document Type and Number:
Japanese Patent JP4193527
Kind Code:
B2
Inventors:
Masaaki Takada
Nobuo Kageyama
Susumu Ota
Nobuo Kageyama
Susumu Ota
Application Number:
JP2003071276A
Publication Date:
December 10, 2008
Filing Date:
March 17, 2003
Export Citation:
Assignee:
Asahi Glass Co., Ltd.
International Classes:
C23C16/44; H01L21/205; H01L21/22
Domestic Patent References:
| JP10195657A | ||||
| JP8195354A |