To provide a semiconductor inspection device capable of reducing the manufacturing cost.
This semiconductor inspection device is equipped with a test head part 2 for connecting a tester to a semiconductor device 11 to inspect the electrical characteristics of the semiconductor device 11, a contact head part 3 for pressurizing the semiconductor device 11 to the head part 2 side to stably holding a connection between the semiconductor device 11 and the tester, a supply/discharge part 4 for forming a space used for supplying the semiconductor device 11 to the test head part 3 while discharging it from the test head part 3, and a conveyance part 5 for conveying the semiconductor device 11 to the test head part 3 and to the supply/discharge part 4.
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada