To reduce the manufacturing cost of a semiconductor integrated circuit device, such as the module, etc.
A semiconductor integrated circuit device is composed of a semiconductor chip 1 which has been sorted through inspections, projecting wire end sections 4a formed on element electrodes 1a after the chip 1 is inspected by using bonding wires for inspection which connect the electrodes on an inspection substrate to the electrodes 1a of the chip 1 on an inspection board and the electrodes 1a of the chip 1, a lead frame 5 which supports the chip 1, and a sealing resin sealing the chip 1 and its peripheral section 6 and the electrodes 1a of the chip 1 are electrically connected to lead sections 5a provided on the frame 5 by means of bonding wires 8 through the wire end sections 4a.
KIKUCHI TAKU
SUMI YOSHIYUKI
NOSE FUJIAKI
MIWA TAKASHI
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