Title:
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP3771097
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate the bump of a semiconductor integrated circuit device constituting the semiconductor device of integrated constitution by a chip-on-chip system, and to improve the degree of freedom on the selection of a combined substrate or the other semiconductor integrated circuit device.
SOLUTION: In the semiconductor integrated circuit device, multiple wiring pads 102 are formed on one face side of a main body 101. The respective wiring pads 102 are exposed/installed at positions in a prescribed depth from the surface of the main body 101. Notches 104 are installed from the wiring pads 102 to one side end of the main body 101. Bumps installed in the substrate or a second semiconductor integrated circuit device are combined to the wiring pads 102 so that they are bonded. The abutting faces of the bumps are made to be longer in the directions of the notches 104 compared to the abutting faces of the wiring pads 102.
Inventors:
Atsushi Muramoto
Application Number:
JP35182199A
Publication Date:
April 26, 2006
Filing Date:
December 10, 1999
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L25/18; H01L23/52; H01L25/065; H01L25/07; (IPC1-7): H01L25/065; H01L25/07; H01L25/18; H01L23/52
Domestic Patent References:
| JP9326465A | ||||
| JP61113252A |
Foreign References:
| WO1999007015A1 |
Attorney, Agent or Firm:
Makoto Monda
Terumi Hemi
Terumi Hemi