Title:
半導体集積回路装置
Document Type and Number:
Japanese Patent JP4040245
Kind Code:
B2
Inventors:
Hiratsuka Jun
Application Number:
JP2000295740A
Publication Date:
January 30, 2008
Filing Date:
September 28, 2000
Export Citation:
Assignee:
NEC Electronics Corporation
International Classes:
G02F1/133; H01L21/822; G09G3/20; G09G3/36; H01L27/04
Domestic Patent References:
| JP2001184036A | ||||
| JP200134234A | ||||
| JP9281933A | ||||
| JP9204160A | ||||
| JP8254684A | ||||
| JP8152596A | ||||
| JP6214530A |
Attorney, Agent or Firm:
Mitsuhiro Hamada