Title:
SEMICONDUCTOR INTEGRATED CIRCUIT AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP2000164611
Kind Code:
A
Abstract:
To provide a semiconductor integrated circuit which is easily thinned and a manufacturing method thereof.
A semiconductor chip 1 is bonded to an island part 2, which is sunk more deeply than peripheral inner lead parts 3. A surface electrode of the semiconductor chip 1 is bonded to the inner lead parts 3 by using wires 4. The semiconductor chip 1 and the wire-bonded inner lead parts 3 are sealed in a package part 5. Finally, the semiconductor chip 1 and the inner lead parts 3 are grounded by an LL' line for every package part 5.
Inventors:
SAWAMOTO SHUICHI
NAKANIWA KATSUKI
NAKANIWA KATSUKI
Application Number:
JP33485998A
Publication Date:
June 16, 2000
Filing Date:
November 26, 1998
Export Citation:
Assignee:
MITSUMI ELECTRIC CO LTD
International Classes:
H01L21/304; H01L21/56; H01L23/50; (IPC1-7): H01L21/56; H01L21/304; H01L23/50