半導体集積回路及び受信信号処理方法

Title:

半導体集積回路及び受信信号処理方法

Document Type and Number:

Japanese Patent JP5155254

Kind Code:

B2

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Inventors:

Mitsuru Banno
Masashi Hoshino
Makoto Hamaminato

Application Number:

JP2009141933A

Publication Date:

March 06, 2013

Filing Date:

June 15, 2009

Export Citation:

Assignee:

富士通株式会社
富士通セミコンダクター株式会社

International Classes:

H04J11/00; G01R23/12

Domestic Patent References:

Attorney, Agent or Firm:

Takeshi Hattori

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