Title:
半導体集積回路
Document Type and Number:
Japanese Patent JP3754058
Kind Code:
B2
Inventors:
Horiguchi Masashi
Uchiyama Man
Kiyoshi Ito
Ken Sakata
Masakazu Aoki
Takayuki Kawahara
Uchiyama Man
Kiyoshi Ito
Ken Sakata
Masakazu Aoki
Takayuki Kawahara
Application Number:
JP2004323953A
Publication Date:
March 08, 2006
Filing Date:
November 08, 2004
Export Citation:
Assignee:
Renesas Technology Corp.
International Classes:
H01L27/04; H03K19/00; H01L21/822; H01L21/8238; H01L27/092
Domestic Patent References:
| JP58070333A | ||||
| JP60048525A | ||||
| JP63120522A | ||||
| JP6029834A | ||||
| JP5347550A | ||||
| JP5210976A |
Attorney, Agent or Firm:
Shizuyo Tamamura