Title:
半導体集積回路およびそのテスト方法並びに製造方法
Document Type and Number:
Japanese Patent JP4147005
Kind Code:
B2
Inventors:
Masayuki Sato
Isao Shimizu
Hideaki Takahashi
Isao Shimizu
Hideaki Takahashi
Application Number:
JP2000611314A
Publication Date:
September 10, 2008
Filing Date:
April 14, 1999
Export Citation:
Assignee:
Renesas Technology Corp.
International Classes:
H01L21/82; G01R31/3185; G11C29/12; H01L21/822; H01L27/04
Domestic Patent References:
| JP2000252361A | ||||
| JP2000124315A | ||||
| JP10313061A | ||||
| JP10302499A | ||||
| JP10242288A | ||||
| JP10241399A | ||||
| JP10233677A | ||||
| JP10223764A | ||||
| JP10221409A | ||||
| JP8298289A | ||||
| JP8095818A | ||||
| JP7099439A | ||||
| JP6045451A | ||||
| JP4368018A | ||||
| JP60074643A |
Attorney, Agent or Firm:
Shizuyo Tamamura