Title:
半導体レーザ装置
Document Type and Number:
Japanese Patent JP7145977
Kind Code:
B2
Abstract:
A semiconductor laser device is configured so that, on at least one of the respective opposing surfaces of a semiconductor laser chip and a sub-mount and the respective opposing surfaces of the sub-mount and a heatsink, one or more treatment regions are provided where adhesion of a bonding material or bonding material used for their bonding is reduced, wherein the one or more treatment regions are placed to define, in a traveling direction of light, different coverages depending on a position in an array direction of multiple light emitting regions.
Inventors:
Yuji Iwai
Miyashita Soji
Kuramoto Kyosuke
Miyashita Soji
Kuramoto Kyosuke
Application Number:
JP2020565094A
Publication Date:
October 03, 2022
Filing Date:
January 10, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01S5/0237; H01S5/022; H01S5/023; H01S5/0236; H01S5/22
Domestic Patent References:
| JP2015502051A | ||||
| JP2009111230A | ||||
| JP2014127543A | ||||
| JP2010219393A | ||||
| JP2010219264A | ||||
| JP2008205342A | ||||
| JP2008198759A | ||||
| JP2008004743A | ||||
| JP2004144794A | ||||
| JP2022089985A |
Foreign References:
| WO2015063973A1 | ||||
| WO2014184844A1 | ||||
| CN106019620A | ||||
| WO2020026730A1 |
Attorney, Agent or Firm:
Parumo Patent Attorneys Office