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Patent Searching and Data


Title:
SEMICONDUCTOR LASER DEVICE
Document Type and Number:
Japanese Patent JPH06350130
Kind Code:
A
Abstract:

PURPOSE: To provide a semiconductor laser device which can superpose a high frequency on a semiconductor laser chip in an optical unit without external leakage by forming an outer frame of insulating material on the periphery of a region of a comb frame comprising the optical unit where a semiconductor laser chip is to be mounted, and mounting a semiconductor laser chip on the comb frame, directly or with a semiconductor substrate in-between.

CONSTITUTION: An optical unit 15 is secured on a printed board 16 including at least a high frequency circuit. The printed board 16 has a through hole 20 formed, and the through hole 20 is so arranged that light projected from a semiconductor laser element will pass through it. Further, the printed board 16 has a metal face 19 on its underside or inside it.


Inventors:
NAKANISHI HIDEYUKI
UENO AKIRA
NAGAI HIDEO
YOSHIKAWA AKIO
Application Number:
JP13450693A
Publication Date:
December 22, 1994
Filing Date:
June 04, 1993
Export Citation:
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Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H01L31/12; H01S5/00; H01S5/022; G02B6/42; H01S3/00; (IPC1-7): H01L31/12; H01S3/18
Attorney, Agent or Firm:
Akira Kobiji (2 outside)