Title:
SEMICONDUCTOR LASER MODULE AND OPTICAL PICKUP
Document Type and Number:
Japanese Patent JP3267859
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To produe a semiconductor laser module incorporated in a unit with a semiconductor laser diode ship and photo detecting element for return lights in a simple structure at low cost.
SOLUTION: A semiconductor laser module 1 comprises a semiconductor substrate 3, a spacer 4 and a transparent plate 5 laminated up in this order on a tilted substrate holding face 21 of a metal support 2. These members 3, 4, 5 can be positioned by butting them against a vertical position surface 22. The semiconductor substrate 3 is incorporated with a photo-diode 7 for the output control of a laser beam and a photo diode 8 for detecting a return light to obtain a tracking error signal, etc. A laser diode chip 6 is mounted on a laser chip hold surface 23 on the upper face of the support 2. Since the components 3, 4, 5 are incorporated by only laminating them up, the manufacturing is simple and low in cost.
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Inventors:
Tadashi Takeda
Yoshio Hayashi
Kazuo Higashiura
Hisahiro Ishihara
Kazuo Kobayashi
Kenichi Hayashi
Yoshio Hayashi
Kazuo Higashiura
Hisahiro Ishihara
Kazuo Kobayashi
Kenichi Hayashi
Application Number:
JP9210096A
Publication Date:
March 25, 2002
Filing Date:
April 15, 1996
Export Citation:
Assignee:
Sankyo Seiki Co., Ltd.
International Classes:
G11B7/09; G11B7/125; G11B7/135; H01S5/00; H01S5/022; (IPC1-7): H01S5/022; G11B7/125; G11B7/135
Domestic Patent References:
| JP4159627A | ||||
| JP3192305A | ||||
| JP6412221U |
Attorney, Agent or Firm:
Shiro Yokozawa (1 person outside)