半導体レーザモジュール及びレーザ加工装置

Japanese Patent JP7316098

B2

To make it easier to mount a semiconductor laser element in a semiconductor laser module.SOLUTION: A semiconductor laser module 1 comprises: a housing 90 that includes a bottom surface 93b; a first base 61 that is disposed on the bottom surface 93b and includes a first upper surface 61t; a first semiconductor laser element 11 that is disposed on the first upper surface 61t and includes a first light-emitting point 11r; a second semiconductor laser element 12 that is disposed on the first upper surface 61t and includes a second light-emitting point 12r; a first deflection element 51 that deflects first laser light L11 emitted from the first light-emitting point 11r; and a second deflection element 52 that deflects second laser light L12 emitted from the second light-emitting point 12r. The first upper surface 61t is inclined with respect to the bottom surface 93b by a first angle θ1. The distance from the bottom surface 93b to the first light-emitting point 11r is longer than the distance from the bottom surface 93b to the second light-emitting point 12r. The near-field pattern of the first light-emitting point 11r and the second light-emitting point 12r in a longitudinal direction is parallel to the first upper surface 61t.SELECTED DRAWING: Figure 1

Gen Shimizu
Kazuhiko Yamanaka
Masayuki Hata
Norio Ikedo

JP2019097551A

July 27, 2023

May 24, 2019

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Nuvoton Technology Japan Co., Ltd.

H01S5/40; G02B6/42; H01S5/02255; H01S5/02315

JP2011204336A
JP2001007432A
JP2016143704A
JP2015056576A
JP2001223431A

US9318876
CN203811855U

Hiromori Arai
Eisaku Teratani
Shinichi Michisaka

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