Title:
SEMICONDUCTOR LASER MODULE
Document Type and Number:
Japanese Patent JPH04352113
Kind Code:
A
Abstract:
PURPOSE:To facilitate the assembly of a package and to prevent an optical fiber from being broken. CONSTITUTION:A base 12 in the package 4 is inserted into the package 4 and fixed after a semiconductor laser 1, the optical fiber 2, and a converging rod lens 6 are fixed. A ferrule 11 provided on the optical fiber 3 is inserted into a lens guide 8 and fixed, and then coupled optically with the optical fiber 2 through a lens 7.
Inventors:
IWANO TADAYUKI
Application Number:
JP12637691A
Publication Date:
December 07, 1992
Filing Date:
May 30, 1991
Export Citation:
Assignee:
NEC CORP
International Classes:
G02B6/42; H01S3/101; H01S5/00; H04B10/00; H04B10/40; H04B10/50; H04B10/60; (IPC1-7): G02B6/42; H01S3/101; H01S3/18; H04B9/00
Attorney, Agent or Firm:
Uchihara Shin