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Title:
SEMICONDUCTOR LASER
Document Type and Number:
Japanese Patent JP2009212524
Kind Code:
A
Abstract:

To provide a semiconductor laser which has a small external diameter while enhancing heat dissipation property by making a heat sink portion large even when a laser chip has a large chip size and large calorific value, and a thin type optical pickup using the same.

A support portion 12 is provided on the side of one bottom portion (base 11) of a stem 1 where at least two leads 14 and 16 are fixed such that they project from both sides. The heat sink portion 13 is formed such that it extends widely toward the two projecting leads 14 and 16 above the support portion 12. The laser chip 2 is mounted on the heat sink portion 13.


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Inventors:
YAMAMOTO GOJI
Application Number:
JP2009095596A
Publication Date:
September 17, 2009
Filing Date:
April 10, 2009
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
H01S5/022; G11B7/125; H01L23/34
Domestic Patent References:
JPH02234457A1990-09-17
JPH06252498A1994-09-09
JPH09270566A1997-10-14
JPH04305989A1992-10-28
JPH1154839A1999-02-26
JPH08125259A1996-05-17
JPH04121768U1992-10-30
JPH04326785A1992-11-16
JPH1011780A1998-01-16
JPH02234457A1990-09-17
JPH06252498A1994-09-09
JPH09270566A1997-10-14
JPH04305989A1992-10-28
JPH1154839A1999-02-26
JPH08125259A1996-05-17
JPH04121768U1992-10-30
JPH04326785A1992-11-16
JPH1011780A1998-01-16
JPH03116510U1991-12-03
Attorney, Agent or Firm:
Sota Asahina
Kawamura Taku



 
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