PURPOSE: To improve the moisture resistance property of a semiconductor lead frame carried on a semiconductor pellet by providing a bent portion at the connecting strip of external lead wire forming the lead, thereby eliminating the gap to occur between the resin seal and the resin root of the external lead.

CONSTITUTION: The lead frame 10 is formed of a mount pad 11 having an external lead wire 12 for carrying the semiconductor pellet and external lead wires 14 disposed at both sides thereof. When connecting strips 16, 17 for fixing the lead wires 12, 14 are spaced at the portion projected out of the resin seal for the wires, a bent portion 16a is disposed between the lead wires 12 and 14 at the strip 16. When the pad 11 is sealed with resin such as epoxy or the like while externally exposing the strip 16, no deformation occurs at the root of the resin between the lead wires 12 and 14, and the moisture resistance property can be improved. Thereafter, the lead wires 12, 14 are cut at the upper end of the strip 16 in an ordinary way including the strip.