Title:
SEMICONDUCTOR LIGHT EMITTING BULB AND LUMINAIRE
Document Type and Number:
Japanese Patent JP2016154088
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting bulb which solves light unevenness (shadow) caused by thickness of a printed wiring board in which semiconductor light emission packages are provided on both sides, and which can improve illuminance.SOLUTION: A printed wiring board 1 is inserted in a reflector 2 made of white resin having low transmissivity (that is, high reflectivity), a lens 3 is fitted in the reflector 2, and a frame 33 for fitting of the lens 3 is fitted in a claw part 25 for fitting of the reflector 2. On the surface side of the printed wiring board 1, a top view type LED package 11S which comprises an LED element and a phosphor layer, a drive circuit package 12 for the LED package 11S and the like are mounted. Also, this is the same for the rear side of the printed wiring board 1. Two LED packages are arranged symmetrically opposing to both surfaces of the printed wiring board 1.SELECTED DRAWING: Figure 2
Inventors:
SATO MASATO
Application Number:
JP2015031486A
Publication Date:
August 25, 2016
Filing Date:
February 20, 2015
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
F21S2/00; F21S8/10; F21V5/04; F21V7/08; F21V23/00; F21V29/00; H01L33/60
Attorney, Agent or Firm:
Shozo Igarashi
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