To provide an edge emission semiconductor light emitting device exhibiting good mountability and a high light takeout efficiency, and its manufacturing method.

The semiconductor light emitting device comprises an electrically insulating substrate, two electrode parts formed on the substrate, a light emitting element chip mounted on one electrode and wire bonded to other electrode through a metal wire, a transparent resin part covering the surface of the light emitting element chip and the metal wire, and a light shielding reflective resin part covering the transparent resin part. In the manufacturing process, two adjacent light emitting element chips are covered with one transparent resin part which is split into two in order to separate two light emitting element chips individually after forming the light shielding reflective resin part, and that splitting plane serves as an emission plane.