To provide a semiconductor light emitting device with a metal reflector which can resist temperature of a lead-free soldering process, and its manufacturing method.
The semiconductor light emitting device comprises an insulating substrate having an electrode pattern, a metal reflector with a through-hole formed on the insulating substrate, an adhesive layer prepared between the insulating substrate and the metal reflector, a semiconductor light emitting element formed on the insulation substrate in the through-hole, and a resin for sealing the semiconductor light emitting element. The inner wall of the through-hole has a light reflecting surface, and at least a part of the light emitted from the semiconductor light emitting element is reflected by the light reflecting surface and released from the through-hole.
INAGAKI SHINICHI
KOMATSU TETSUO
MIYAGAWA TAKESHI
INOUE ATSUO
KUSAKA TASUKU
TAKAHASHI FUJIO
