To provide a semiconductor light emitting device capable of compounding an Si diode and a light emitting element for protecting static electricity to be mounted on a lead frame and wirebonded without short circuiting at all.
An Si diode 4 and an auxiliary element 5 for protecting static electricity are mounted on a mounting surface of a lead frame or substrate, etc., turning respective main surfaces upward as well as a flipchip type light emitting element 1 on the diode 4 and the auxiliary element 5 turning respective main surfaces downward. Next, the pn junction of the light emitting element 1 connected to the Si diode 4 by microbumps 2a, 3a while the n side electrode 2 of the light emitting element 1 is connected to a conductive pad 5b on the auxiliary element 5 by an adhesive 7 furthermore to be wirebonded to the conductive pad 5b exposed from the light emitting element 1.
INOUE TOMIO
UCHI YOSHIBUMI
