To provide a semiconductor light-emitting device in which light leakage from a semiconductor light-emitting element is eliminated and the amount of a phosphor used can be minimized.
In the semiconductor light-emitting device including a semiconductor light-emitting element 3 mounted on a circuit board, the light-emitting surface of the semiconductor light-emitting element 3 is covered with a phosphor sheet 1. The phosphor sheet 1 has a storage modulus of 0.5 MPa or more at 25°C, and less than 0.1 MPa at 100°C. The length 2 not covered with the phosphor sheet 1 does not exceed 5 μm at the edge of the semiconductor light-emitting element 3, and the length of the phosphor sheet 1 hanging over the edge of the semiconductor light-emitting element 3 does not exceed 5 μm.
JP5785499 | Wafer level white LED color correction |
JP2009135152 | LIGHT EMITTING APPARATUS |
WO/2009/095662 | LIGHT EMITTING MODULE WITH OPTICALLY-TRANSPARENT THERMALLY-CONDUCTIVE ELEMENT |
MATSUMURA NOBUO
YOSHIOKA MASAHIRO
JP2010258281A | 2010-11-11 | |||
JP2007103901A | 2007-04-19 | |||
JP2010258281A | 2010-11-11 | |||
JP2007103901A | 2007-04-19 |
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